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 PROFET(R) BTS 442 E2
Smart Highside Power Switch
Features
* Overload protection * Current limitation * Short-circuit protection * Thermal shutdown * Overvoltage protection (including load dump) * Fast demagnetization of inductive loads * Reverse battery protection1) * Undervoltage and overvoltage shutdown with auto-restart and hysteresis * Open drain diagnostic output * Open load detection in ON-state * CMOS compatible input * Loss of ground and loss of Vbb protection2) * Electrostatic discharge (ESD) protection
Product Summary Overvoltage protection Operating voltage On-state resistance Load current (ISO) Current limitation
Vbb(AZ) Vbb(on) RON IL(ISO) IL(SCr)
63 V 4.5 ... 42 V 18 m 21 A 70 A
TO-220AB/5
5 5 1
Straight leads
5 1 1
Standard
SMD
Application
* C compatible power switch with diagnostic feedback for 12 V and 24 V DC grounded loads * All types of resistive, inductive and capacitve loads * Replaces electromechanical relays and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic feedback, integrated in Smart SIPMOS chip on chip technology. Fully protected by embedded protection functions.
R bb
+ V bb
3
Voltage source
Overvoltage protection
Current limit
Gate protection
V Logic
Voltage sensor Charge pump Level shifter Rectifier Open load ESD Logic detection Limit for unclamped ind. loads
OUT
2
IN
Temperature sensor
5
Load
4
ST
Short circuit detection
GND
PROFET
Load GND
1
Signal GND
1) 2)
No external components required, reverse load current limited by connected load. Additional external diode required for charged inductive loads
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PROFET(R) BTS 442 E2
Pin 1 2 3 4 5
Symbol GND IN Vbb ST OUT (Load, L) I + S O
Function Logic ground Input, activates the power switch in case of logical high signal Positive power supply voltage, the tab is shorted to this pin Diagnostic feedback, low on failure Output to the load
Maximum Ratings at Tj = 25 C unless otherwise specified Parameter Supply voltage (overvoltage protection see page 3) Load dump protection VLoadDump = UA + Vs, UA = 13.5 V RI= 2 , RL= 1.1 , td= 200 ms, IN= low or high Load current (Short-circuit current, see page 4) Operating temperature range Storage temperature range Power dissipation (DC) Inductive load switch-off energy dissipation, single pulse Tj=150 C: Electrostatic discharge capability (ESD) (Human Body Model) Input voltage (DC) Current through input pin (DC) Current through status pin (DC)
see internal circuit diagrams page 6...
Symbol Vbb VLoad dump3)
Values 63 80 self-limited -40 ...+150 -55 ...+150 167 2.1 2.0 -0.5 ... +6 5.0 5.0 0.75 75 tbd
Unit V V A C W J kV V mA
IL Tj Tstg Ptot EAS VESD VIN IIN IST
Thermal resistance
chip - case: junction - ambient (free air): SMD version, device on pcb 4):
RthJC RthJA
K/W
3) 4)
VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70m thick) copper area for Vbb connection. PCB is vertical without blown air.
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Electrical Characteristics
Parameter and Conditions
at Tj = 25 C, Vbb = 12 V unless otherwise specified
Symbol
Values min typ max
Unit
Load Switching Capabilities and Characteristics On-state resistance (pin 3 to 5)
IL = 5 A
Nominal load current (pin 3 to 5) ISO Proposal: VON = 0.5 V, TC = 85 C Output current (pin 5) while GND disconnected or GND pulled up, VIN= 0, see diagram page 7, Tj =-40...+150C Turn-on time to 90% VOUT: Turn-off time to 10% VOUT: RL = 12 , Tj =-40...+150C Slew rate on 10 to 30% VOUT, RL = 12 , Tj =-40...+150C Slew rate off 70 to 40% VOUT, RL = 12 , Tj =-40...+150C
Tj=25 C: RON Tj=150 C: IL(ISO) IL(GNDhigh)
-17 --
15 28 21 --
18 35 -1
m A mA s
ton toff
dV /dton -dV/dtoff
100 10 0.2 0.4
-----
350 130 2 5
V/s V/s
Operating Parameters Operating voltage 5) Tj =-40...+150C: Undervoltage shutdown Tj =-40...+150C: Undervoltage restart Tj =-40...+150C: Undervoltage restart of charge pump see diagram page 12 Tj =-40...+150C: Undervoltage hysteresis Vbb(under) = Vbb(u rst) - Vbb(under) Overvoltage shutdown Tj =-40...+150C: Overvoltage restart Tj =-40...+150C: Overvoltage hysteresis Tj =-40...+150C: 6) Overvoltage protection Tj =-40C: Ibb=40 mA Tj =25...+150C: Standby current (pin 3) Tj=-40...+25C: VIN=0 Tj=150C: Leakage output current (included in Ibb(off)) VIN=0 Operating current (Pin 1) 7), VIN=5 V
5) 6) 7)
Vbb(on) Vbb(under) Vbb(u rst) Vbb(ucp)
Vbb(under)
4.5 2.4 ---42 42 -60 63 -----
---6.5 0.2 --0.2 -67 12 18 6 1.1
42 4.5 4.5 7.5 -52 ---25 60 ---
V V V V V V V V V A A mA
Vbb(over) Vbb(o rst) Vbb(over) Vbb(AZ) Ibb(off) IL(off) IGND
At supply voltage increase up to Vbb= 6.5 V typ without charge pump, VOUT Vbb - 2 V see also VON(CL) in table of protection functions and circuit diagram page 7. Meassured without load. Add IST, if IST > 0, add IIN, if VIN>5.5 V
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Parameter and Conditions
at Tj = 25 C, Vbb = 12 V unless otherwise specified
Symbol
Values min typ max
Unit
Protection Functions Initial peak short circuit current limit (pin 3 to 5) 8), IL(SCp) ( max 400 s if VON > VON(SC) ) Tj =-40C: Tj =25C: =+150C: Tj Repetitive short circuit current limit IL(SCr) Tj = Tjt (see timing diagrams, page 10) Short circuit shutdown delay after input pos. slope VON > VON(SC), Tj =-40..+150C: td(SC)
min value valid only, if input "low" time exceeds 30 s
--45 30 80
-95 -70 --
140 ---400
A
A s V V C K J
Output clamp (inductive load switch off) at VOUT = Vbb - VON(CL), IL= 30 mA Short circuit shutdown detection voltage (pin 3 to 5) Thermal overload trip temperature Thermal hysteresis Inductive load switch-off energy dissipation 9), Tj Start = 150 C, single pulse Vbb = 12 V: Vbb = 24 V: Reverse battery (pin 3 to 1) 10) Integrated resistor in Vbb line Diagnostic Characteristics Open load detection current
(on-condition)
VON(CL) VON(SC) Tjt Tjt EAS ELoad12 ELoad24
-Vbb Rbb
--150 ---
58 8.3 -10 --
----2.1 1.7 1.2 32 --
---
-120
V
Tj=-40 C: IL (OL) Tj=25..150C:
2 2
---
1900 1500
mA
8) 9)
Short circuit current limit for max. duration of td(SC) max=400 s, prior to shutdown
While demagnetizing load inductance, dissipated energy in PROFET is EAS= VON(CL) * iL(t) dt, approx. VON(CL) 2 EAS= 1/2 * L * IL * ( ), see diagram page 8 VON(CL) - Vbb 10) Reverse load current (through intrinsic drain-source diode) is normally limited by the connected load. Reverse current IGND of 0.3 A at Vbb= -32 V through the logic heats up the device. Time allowed under these condition is dependent on the size of the heatsink. Reverse IGND can be reduced by an additional external GND-resistor (150 ). Input and Status currents have to be limited (see max. ratings page 2 and circuit page 7).
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Parameter and Conditions
at Tj = 25 C, Vbb = 12 V unless otherwise specified
Symbol
Values min typ max
Unit
Input and Status Feedback11) Input turn-on threshold voltage
Tj =-40..+150C:
Input turn-off threshold voltage
VIN(T+) VIN(T-)
VIN(T) IIN(off)
1.5 1.0 -1 10 80 350
--0.5 -25 200 --
2.4 --30 50 400 1600
V V V A A s s
Tj =-40..+150C:
Input threshold hysteresis Off state input current (pin 2), VIN = 0.4 V On state input current (pin 2), VIN = 3.5 V Status invalid after positive input slope (short circuit) Tj=-40 ... +150C: Status invalid after positive input slope Tj=-40 ... +150C: (open load) Status output (open drain) Zener limit voltage Tj =-40...+150C, IST = +1.6 mA: ST low voltage Tj =-40...+150C, IST = +1.6 mA:
IIN(on) td(ST SC) td(ST)
VST(high) VST(low)
5.4 --
6.1 --
-0.4
V
11)
If a ground resistor RGND is used, add the voltage drop across this resistor.
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PROFET(R) BTS 442 E2
Truth Table
Inputlevel Normal operation Open load Short circuit to GND Short circuit to Vbb Overtemperature Undervoltage Overvoltage L = "Low" Level H = "High" Level L H L H L H L H L H L H L H Output level L H
12)
Status 442 D2 H H H L H L H H (L13)) L L L14) L14) L L 442 E2 H H H L H L H H (L13)) L L H H H H
H L L H H L L L L L L
Terms
Ibb
I IN
2
I ST
Status output
+5V
3
IN
Vbb
IL
VON
R ST(ON)
OUT
ST
PROFET
4
5
ST GND
1
V
IN
VST
GND
IGND VOUT
ESDZD
V
bb
R
GND
Input circuit (ESD protection)
R
ESD-Zener diode: 6.1 V typ., max 5 mA; RST(ON) < 250 at 1.6 mA, ESD zener diodes are not to be used as voltage clamp at DC conditions. Operation in this mode may result in a drift of the zener voltage (increase of up to 1 V).
IN
I
ESDZDI1 ZDI2
I
I
GND
ZDI1 6.1 V typ., ESD zener diodes are not to be used as voltage clamp at DC conditions. Operation in this mode may result in a drift of the zener voltage (increase of up to 1 V).
12) 13) 14)
Power Transistor off, high impedance Low resistance short Vbb to output may be detected by no-load-detection No current sink capability during undervoltage shutdown
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Short Circuit detection
Fault Condition: VON > 8.3 V typ.; IN high
+ V bb
Open-load detection
ON-state diagnostic condition: VON < RON * IL(OL); IN high
+ V bb
V ON
ON
OUT
VON
Logic unit
Short circuit detection
OUT
Logic unit
Open load detection
Inductive and overvoltage output clamp
+ V bb V Z V ON
GND disconnect
3
OUT
GND
2
IN
Vbb PROFET OUT
VON clamped to 58 V typ.
4 ST
5
Overvolt. and reverse batt. protection
V
+ V bb
GND 1 V GND
bb
V
IN
V
ST
V
R IN
Z
R bb
Any kind of load. In case of Input=high is VOUT VIN - VIN(T+) . Due to VGND >0, no VST = low signal available.
IN
Logic
V
GND disconnect with GND pull up
OUT
R ST
ST GND
3
PROFET
2 IN
Vbb PROFET OUT
R GND
Signal GND
5
Rbb = 120 typ., VZ +Rbb*40 mA = 67 V typ., add RGND, RIN, RST for extended protection
V V bb
4
ST GND 1
V IN ST
V
GND
Any kind of load. If V GND > VIN - VIN(T+) device stays off Due to VGND >0, no VST = low signal available.
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PROFET(R) BTS 442 E2
Vbb disconnect with charged inductive load
3 high 2 IN Vbb PROFET 4 ST GND 1 V OUT
Inductive Load switch-off energy dissipation
E bb E AS Vbb PROFET OUT EL GND ER ELoad
IN
5
=
ST
bb
Energy dissipated in PROFET EAS = Ebb + EL - ER.
3 high 2 IN Vbb PROFET 4 ST GND 1 V OUT
ELoad < EL, EL = 1/2 * L * I L
2
5
bb
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PROFET(R) BTS 442 E2
Options Overview
all versions: High-side switch, Input protection, ESD protection, load dump and reverse battery protection , protection against loss of ground Type Logic version
BTS 442D2 442E2 D X X X X E
Overtemperature protection Tj >150 C, latch function 15)16) Tj >150 C, with auto-restart on cooling Short-circuit to GND protection
switches off when VON>8.3 V typ.15) (when first turned on after approx. 200 s)
Open load detection
in OFF-state with sensing current 30 A typ. in ON-state with sensing voltage drop across power transistor X X X X X -17) X X X X X X X X X X -17) X -
Undervoltage shutdown with auto restart Overvoltage shutdown with auto restart Status feedback for
overtemperature short circuit to GND short to Vbb open load undervoltage overvoltage
Status output type
CMOS Open drain
Output negative voltage transient limit
(fast inductive load switch off) to Vbb - VON(CL) X X X X
Load current limit
high level (can handle loads with high inrush currents) medium level low level (better protection of application)
Latch except when Vbb -VOUT < VON(SC) after shutdown. In most cases VOUT = 0 V after shutdown (VOUT 0 V only if forced externally). So the device remains latched unless Vbb < VON(SC) (see page 4). No latch between turn on and td(SC). 16) With latch function. Reseted by a) Input low, b) Undervoltage, c) Overvoltage 17) Low resistance short V to output may be detected by no-load-detection bb
15)
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PROFET(R) BTS 442 E2
Timing diagrams
Figure 1a: Vbb turn on: Figure 2b: Switching an inductive load
IN IN t d(bb IN) V bb ST
*)
td(ST)
V
OUT
V A
OUT
ST open drain t A
in case of too early VIN=high the device may not turn on (curve A) td(bb IN) approx. 150 s
I
L
IL(OL) t
*) if the time constant of load is too large, open-load-status may occur
Figure 2a: Switching a lamp, Figure 3a: Turn on into short circuit,
IN IN
ST ST
V
OUT
V
OUT
td(SC) I
L
I
L
t t
td(SC) approx. 200s if Vbb - VOUT > 8.3 V typ.
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PROFET(R) BTS 442 E2
Figure 3b: Turn on into overload,
Figure 4a: Overtemperature: Reset if Tj IN IN
IL I L(SCp) IL(SCr)
ST
V
OUT
T ST t
J
t
Heating up may require several milliseconds, Vbb - VOUT < 8.3 V typ.
Figure 3c: Short circuit while on:
Figure 5a: Open load: detection in ON-state, turn on/off to open load
IN
IN
ST
ST
t d(ST)
V OUT
V
OUT
IL
I **) t
L
open t
**) current peak approx. 20 s
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PROFET(R) BTS 442 E2
Figure 5b: Open load: detection in ON-state, open load occurs in on-state
Figure 6b: Undervoltage restart of charge pump VON [V]
V on IN
VON(CL) off
t d(ST OL1) ST
t
d(ST OL2)
V
OUT
V off
bb(over)
V I
L
V V
bb(u rst)
bb(o rst)
normal
open
normal V t
bb(under)
bb(u cp)
on V bb
td(ST OL1) = tbd s typ., t d(ST OL2) = tbd s typ
Vbb [V]
charge pump starts at Vbb(ucp) =6.5 V typ.
Figure 6a: Undervoltage:
Figure 7a: Overvoltage:
IN
IN
V bb V
bb(under)
Vbb Vbb(u cp) V
bb(u rst)
V ON(CL)
Vbb(over)
V bb(o rst)
V V OUT
OUT
ST open drain
ST
t
t
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PROFET(R) BTS 442 E2
Package and Ordering Code
All dimensions in mm
Standard TO-220AB/5
BTS 442 E2
Ordering code Q67060-S6206-A2
TO-220AB/5, Option E3043 Ordering code
BTS 442 E2 E3043 Q67060-S6206-A3
SMD TO-220AB/5, Opt. E3062 Ordering code
BTS442E2 E3062A T&R: Q67060-S6206-A4
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PROFET(R) BTS 442 E2
Edition 22.03.99 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 Munchen, Germany
(c) Infineon Technologies AG 2000.
All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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